東正半導體芯材料科技有限公司
About this company
東正半導體芯材料科技有限公司 is a Hong Kong private company limited by shares incorporated on July 26, 2023. It is registered with company registration (CR) number 3302278 and business registration number (BRN) 75550323. It is one of 133,562 companies incorporated in Hong Kong in 2023. The company was dissolved on April 17, 2025. Its registered office was at 17/F ONE ISLAND EAST TAIKOO PLACE 18 WESTLANDS RD QUARRY BAY HONG KONG. There are 11 documents on file with the Companies Registry dating back to 2023, most recently Information sheet re S.751(3) filed on April 17, 2025.
Company Information
- CR Number
- 3302278
- BRN
- 75550323
- Company Type
- Private company limited by shares
- Type Category
- Local company
Dates & Status
- Incorporation Date
- 2023-07-26
- Dissolution Date
- 2025-04-17
- Has Charges
- No
- Dormant
- No
Lifecycle & Winding-up
Registered office
Current address
17/F ONE ISLAND EAST TAIKOO PLACE 18 WESTLANDS RD QUARRY BAY HONG KONG
Name History
| Name | From | To |
|---|---|---|
| 東正半導體芯材料科技有限公司 | 2023-07-26 | Current |
Company Documents
Information sheet re S.751(3)
2025-04-17 · Other
Information sheet re S.751(1)
2024-12-20 · Other
(E)FNR2 - Notice of Location of Registers and Company Records
2024-12-05 · Other
(E) FNDR1 - Application for Deregistration of Private Company or Company Limited by Guarantee
2024-11-20 · Other
(E)FNAR1 - Annual Return
2024-08-19 · Annual Return
(E)FND2B - Notice of Change in Particulars of Company Secretary and Director
2024-08-19 · Director/Secretary Change
Information Sheet regarding Using Business Registration Number as Unique Business Identifier
2023-12-27 · Other
(E)FNR2 - Notice of Location of Registers and Company Records
2023-08-16 · Other
(E)FNNC1 - Incorporation Form (Company Limited by Shares)
2023-07-26 · Share Related
(E)Articles of Association
2023-07-26 · Memorandum & Articles
Certificate of Incorporation
2023-07-26 · Incorporation
| Document | Type | Filing Date | Order |
|---|---|---|---|
| Information sheet re S.751(3) | Other | 2025-04-17 | |
| Information sheet re S.751(1) | Other | 2024-12-20 | |
| (E)FNR2 - Notice of Location of Registers and Company Records | Other | 2024-12-05 | |
| (E) FNDR1 - Application for Deregistration of Private Company or Company Limited by Guarantee | Other | 2024-11-20 | |
| (E)FNAR1 - Annual Return | Annual Return | 2024-08-19 | |
| (E)FND2B - Notice of Change in Particulars of Company Secretary and Director | Director/Secretary Change | 2024-08-19 | |
| Information Sheet regarding Using Business Registration Number as Unique Business Identifier | Other | 2023-12-27 | |
| (E)FNR2 - Notice of Location of Registers and Company Records | Other | 2023-08-16 | |
| (E)FNNC1 - Incorporation Form (Company Limited by Shares) | Share Related | 2023-07-26 | |
| (E)Articles of Association | Memorandum & Articles | 2023-07-26 | |
| Certificate of Incorporation | Incorporation | 2023-07-26 |
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Frequently asked questions
When was 東正半導體芯材料科技有限公司 incorporated?
東正半導體芯材料科技有限公司 was incorporated in Hong Kong on July 26, 2023.
Is 東正半導體芯材料科技有限公司 still active?
No. 東正半導體芯材料科技有限公司 was dissolved on April 17, 2025.
What are 東正半導體芯材料科技有限公司's CR number and BRN?
東正半導體芯材料科技有限公司's company registration (CR) number is 3302278 and its business registration number (BRN) is 75550323.
Where is 東正半導體芯材料科技有限公司's registered office?
東正半導體芯材料科技有限公司's registered office was at 17/F ONE ISLAND EAST TAIKOO PLACE 18 WESTLANDS RD QUARRY BAY HONG KONG.
What type of company is 東正半導體芯材料科技有限公司?
東正半導體芯材料科技有限公司 is a private company limited by shares on the Hong Kong Companies Registry.
How many documents has 東正半導體芯材料科技有限公司 filed?
東正半導體芯材料科技有限公司 has 11 documents on file with the Hong Kong Companies Registry, dating back to 2023.
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