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BONDSEMI TECHNOLOGY LIMITED

振邦微科技有限公司

2010-05-26 · Data updated: 2026-03-18

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About this company

BONDSEMI TECHNOLOGY LIMITED is a Hong Kong private company limited by shares incorporated on May 26, 2010. It is registered with company registration (CR) number 1460759 and business registration number (BRN) 52325347. It is one of 140,298 companies incorporated in Hong Kong in 2010. The company was deregistered on July 17, 2015. There are 14 documents on file with the Companies Registry dating back to 2010, most recently Information sheet re S.751(3) filed on July 17, 2015.

Company Information

CR Number
1460759
BRN
52325347
Type Category
Local company

Dates & Status

Incorporation Date
2010-05-26
Dissolution Date
2015-07-17
Dissolution Mode
Deregistration
Has Charges
No
Dormant
No

Lifecycle & Winding-up

Deregistered
Yes 2015-07-17

Name History

Name History
Name From To
振邦微科技有限公司 2010-05-26 Current
BONDSEMI TECHNOLOGY LIMITED 2010-05-26 Current

Company Documents

14

Information sheet re S.751(3)

2015-07-17 · Other

Information sheet re S.751(1)

2015-03-27 · Other

(E) FNDR1 - Application for Deregistration of Private Company or Company Limited by Guarantee

2015-03-06 · Other

(E)FNAR1 - Annual Return

2014-10-31 · Annual Return

(E)FNAR1 - Annual Return

2014-10-31 · Annual Return

(E)FND2A - Notice of Change of Company Secretary and Director (Appointment/Cessation)

2014-10-31 · Director/Secretary Change

(E)FNR1 - Notice of Change of Address of Registered Office

2014-10-31 · Address Change

(E)FAR1 - Annual return (with a list of members)

2012-05-31 · Annual Return

(E)FAR1 - Annual return (with a list of members)

2011-05-26 · Annual Return

(E)FSC4 - Notification of Increase in Nominal Share Capital

2010-05-28 · Share Related

(E)FSC1 - Return of Allotments

2010-05-28 · Share Related

(E)Memorandum & Articles of Association

2010-05-26 · Memorandum & Articles

(E)FNC1 - Incorporation Form (Company Limited by Shares)

2010-05-26 · Share Related

Certificate of Incorporation

2010-05-26 · Incorporation

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Incorporated the same year

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Frequently asked questions

When was BONDSEMI TECHNOLOGY LIMITED incorporated?

BONDSEMI TECHNOLOGY LIMITED was incorporated in Hong Kong on May 26, 2010.

Is BONDSEMI TECHNOLOGY LIMITED still active?

No. BONDSEMI TECHNOLOGY LIMITED was deregistered on July 17, 2015.

What are BONDSEMI TECHNOLOGY LIMITED's CR number and BRN?

BONDSEMI TECHNOLOGY LIMITED's company registration (CR) number is 1460759 and its business registration number (BRN) is 52325347.

What type of company is BONDSEMI TECHNOLOGY LIMITED?

BONDSEMI TECHNOLOGY LIMITED is a private company limited by shares on the Hong Kong Companies Registry.

How many documents has BONDSEMI TECHNOLOGY LIMITED filed?

BONDSEMI TECHNOLOGY LIMITED has 14 documents on file with the Hong Kong Companies Registry, dating back to 2010.

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Source: Hong Kong Companies Registry (ICRIS) public records · site data synced 2026-10-31 · How this data is compiled
Data sourced from Renavon.com