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GOLD BOND ENGINEERING MATERIALS LIMITED

金邦工程物料有限公司

2006-07-29 · Data updated: 2026-03-12

About this company

GOLD BOND ENGINEERING MATERIALS LIMITED is a Hong Kong private company limited by shares incorporated on July 29, 2006. It is registered with company registration (CR) number 1063221 and business registration number (BRN) 37019812. It is one of 82,685 companies incorporated in Hong Kong in 2006. The company was deregistered on June 23, 2017. There are 30 documents on file with the Companies Registry dating back to 2006, most recently Information sheet re S.751(3) filed on June 23, 2017.

Company Information

CR Number
1063221
BRN
37019812
Type Category
Local company

Dates & Status

Incorporation Date
2006-07-29
Dissolution Date
2017-06-23
Dissolution Mode
Deregistration
Has Charges
No
Dormant
No

Lifecycle & Winding-up

Deregistered
Yes 2017-06-23

Name History

Name History
Name From To
金邦工程物料有限公司 2006-07-29 Current
GOLD BOND ENGINEERING MATERIALS LIMITED 2006-07-29 Current

Company Documents

30

Information sheet re S.751(3)

2017-06-23 · Other

Information sheet re S.751(1)

2017-03-03 · Other

(E) FNDR1 - Application for Deregistration of Private Company or Company Limited by Guarantee

2017-02-15 · Other

(E)FNAR1 - Annual Return

2016-08-05 · Annual Return

(E)FND2B - Notice of Change in Particulars of Company Secretary and Director

2016-06-14 · Director/Secretary Change

(E)FNR1 - Notice of Change of Address of Registered Office

2016-03-09 · Address Change

(E)FND2B - Notice of Change in Particulars of Company Secretary and Director

2015-12-09 · Director/Secretary Change

(E)FNAR1 - Annual Return

2015-09-16 · Annual Return

(E)FNAR1 - Annual Return

2014-10-17 · Annual Return

(E)FAR1 - Annual return (with a list of members)

2013-08-29 · Annual Return

(E)FAR1 - Annual return (with a list of members)

2012-08-15 · Annual Return

(E)FD2A - Notification of Change of Secretary and Director (Appointment/Cessation)

2012-08-15 · Director/Secretary Change

(E)FD4 - Notification of Resignation of Secretary and Director

2012-08-07 · Director/Secretary Change

(E)FAR1 - Annual return (with a list of members)

2011-09-02 · Annual Return

(E)FD2B - Notification of Change of Particulars of Secretary and Director

2010-08-24 · Director/Secretary Change

(E)FAR1 - Annual return (with a list of members)

2010-08-24 · Annual Return

(E)FR1 - Notification of Change of Address of Registered Office

2009-11-16 · Address Change

(E)FAR1 - Annual return (with a list of members)

2009-08-14 · Annual Return

(E)Amended document

2008-12-29 · Other

(E)FD2B - Notification of Change of Particulars of Secretary and Director

2008-08-14 · Director/Secretary Change

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Incorporated the same year

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Frequently asked questions

When was GOLD BOND ENGINEERING MATERIALS LIMITED incorporated?

GOLD BOND ENGINEERING MATERIALS LIMITED was incorporated in Hong Kong on July 29, 2006.

Is GOLD BOND ENGINEERING MATERIALS LIMITED still active?

No. GOLD BOND ENGINEERING MATERIALS LIMITED was deregistered on June 23, 2017.

What are GOLD BOND ENGINEERING MATERIALS LIMITED's CR number and BRN?

GOLD BOND ENGINEERING MATERIALS LIMITED's company registration (CR) number is 1063221 and its business registration number (BRN) is 37019812.

What type of company is GOLD BOND ENGINEERING MATERIALS LIMITED?

GOLD BOND ENGINEERING MATERIALS LIMITED is a private company limited by shares on the Hong Kong Companies Registry.

How many documents has GOLD BOND ENGINEERING MATERIALS LIMITED filed?

GOLD BOND ENGINEERING MATERIALS LIMITED has 30 documents on file with the Hong Kong Companies Registry, dating back to 2006.

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Source: Hong Kong Companies Registry (ICRIS) public records · site data synced 2026-09-15
Data sourced from Renavon.com