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HONGKONG BONDTECH CO., LIMITED

香港邦泰科技有限公司

Dissolved Dormant
2004-06-21 · Data updated: 2026-03-13

About this company

HONGKONG BONDTECH CO., LIMITED is a Hong Kong private company limited by shares incorporated on June 21, 2004. It is registered with company registration (CR) number 0907834 and business registration number (BRN) 34667351. It is one of 66,313 companies incorporated in Hong Kong in 2004. The company was deregistered on January 10, 2020. There are 33 documents on file with the Companies Registry dating back to 2004, most recently Information sheet re S.751(3) filed on January 10, 2020.

Company Information

CR Number
0907834
BRN
34667351
Type Category
Local company

Dates & Status

Incorporation Date
2004-06-21
Dissolution Date
2020-01-10
Dissolution Mode
Deregistration
Has Charges
No
Dormant
Yes
Dormancy Start
2019-07-19

Lifecycle & Winding-up

Deregistered
Yes 2020-01-10

Name History

Name History
Name From To
香港邦泰科技有限公司 2004-06-21 Current
HONGKONG BONDTECH CO., LIMITED 2004-06-21 Current

Company Documents

33

Information sheet re S.751(3)

2020-01-10 · Other

Information sheet re S.751(1)

2019-09-20 · Other

(E) FNDR1 - Application for Deregistration of Private Company or Company Limited by Guarantee

2019-08-26 · Other

(E)Special Resolution (Dormant Company)

2019-07-19 · Other

(E)FND2A - Notice of Change of Company Secretary and Director (Appointment/Cessation)

2019-06-26 · Director/Secretary Change

(E)FND4 - Notice of Resignation of Company Secretary and Director

2019-06-26 · Director/Secretary Change

(E)FNAR1 - Annual Return

2019-06-26 · Annual Return

(E)FNAR1 - Annual Return

2018-06-21 · Annual Return

(E)FNAR1 - Annual Return

2017-06-21 · Annual Return

(E)FND2B - Notice of Change in Particulars of Company Secretary and Director

2017-06-21 · Director/Secretary Change

(E)Amended document

2016-10-17 · Other

(E)FNAR1 - Annual Return

2016-06-21 · Annual Return

(E)FND2A - Notice of Change of Company Secretary and Director (Appointment/Cessation)

2016-05-30 · Director/Secretary Change

(E)FND4 - Notice of Resignation of Company Secretary and Director

2016-05-30 · Director/Secretary Change

(E)FNAR1 - Annual Return

2015-06-22 · Annual Return

(E)FNAR1 - Annual Return

2014-06-23 · Annual Return

(E)FAR1 - Annual return (with a list of members)

2013-06-21 · Annual Return

(E)FAR1 - Annual return (with a list of members)

2012-06-22 · Annual Return

(E)FAR1 - Annual return (with a list of members)

2011-06-21 · Annual Return

(E)FAR1 - Annual return (with a list of members)

2010-06-21 · Annual Return

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Incorporated the same year

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Frequently asked questions

When was HONGKONG BONDTECH CO., LIMITED incorporated?

HONGKONG BONDTECH CO., LIMITED was incorporated in Hong Kong on June 21, 2004.

Is HONGKONG BONDTECH CO., LIMITED still active?

No. HONGKONG BONDTECH CO., LIMITED was deregistered on January 10, 2020.

What are HONGKONG BONDTECH CO., LIMITED's CR number and BRN?

HONGKONG BONDTECH CO., LIMITED's company registration (CR) number is 0907834 and its business registration number (BRN) is 34667351.

What type of company is HONGKONG BONDTECH CO., LIMITED?

HONGKONG BONDTECH CO., LIMITED is a private company limited by shares on the Hong Kong Companies Registry.

How many documents has HONGKONG BONDTECH CO., LIMITED filed?

HONGKONG BONDTECH CO., LIMITED has 33 documents on file with the Hong Kong Companies Registry, dating back to 2004.

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Source: Hong Kong Companies Registry (ICRIS) public records · site data synced 2026-09-22
Data sourced from Renavon.com